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Using Pin Fin Structures of a New Type for Liquid Cooling of Electronic Equipment
| Authors: Zubkov N.N., Ovchinnikov A.I., Trofimovich A.S., Cherkasov A.S. | Published: 07.04.2014 |
| Published in issue: #2(95)/2014 | |
| DOI: | |
| Category: Simulation of Processes | |
| Keywords: convective heat transfer, pin fin surfaces, deformational cutting, microchip cooling | |