Using Pin Fin Structures of a New Type for Liquid Cooling of Electronic Equipment

Authors: Zubkov N.N., Ovchinnikov A.I., Trofimovich A.S., Cherkasov A.S. Published: 07.04.2014
Published in issue: #2(95)/2014  


Category: Simulation of Processes  
Keywords: convective heat transfer, pin fin surfaces, deformational cutting, microchip cooling

A new technology of deformational cutting (DC) for manufacturing the pin fin heat transfer surfaces is presented. The use of DC technology is a relevant and promising way to create a cooling device for power electronics and microprocessor technology with improved heat transfer parameters. The technique, test bench design, and results of the tests of heat transfer surfaces having pin fin structures of a new type, obtained by DC, are given. Pin fin structures having spiral and angled needle-shaped pins were tested with water convective cooling. A high efficiency of the pin fin structures obtained by DC for use in systems of water cooling of electronic equipment is proved. Comparative tests have revealed that the heat transfer surfaces with angled needle-shaped pins demonstrate the better heat transfer performance both in thermal efficiency and hydraulic resistance as compared to those with spiral pins. The heat transfer and liquid flow computer modeling performed using the SolidWorks Flow Simulation program showed a good agreement between computation results and experimental data.


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